TGV breakthrough, glass cover leads CoWoS, CPO and FOPLP innovation

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This article will show you the following: TGV improves vertical interconnection efficiency, promotes 3D packaging innovation glass covers to help high-frequency applications, and earns super-large-size advanced packaging

TGV improves vertical interconnection efficiency, and promotes 3D packaging innovation. TGV has become the core element of the new generation of 3D integration. Compared with traditional TSV, TGV uses high-quality borosilicon glass or quartz glass as the loading plate, precision drilling and electric filling are used to achieve vertically-oriented gas interconnection. This article will show you the following: TGV improves vertical interconnection efficiency, promotes 3D packaging and innovative glass covers to help high-frequency applications, and earns super-large-size advanced packaging.